Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

• Tipo: Artigo em Revista Científica Internacional
• Data: 2000

Autores

J. Ferreira (Autor) Outra; E. Fortunato (Autor) Outra; A. P. Marvão (Autor) Outra; José Inácio Martins (Autor) FEUP

Revista

Título: Applied Surface Science

Vol. 168 Nº 1-4

Páginas: 292-295

ISSN: 0169-4332

Editora: Elsevier

Indexação

ISI Web of Knowledge - 4 Citações

ISI Web of Science

Scopus - 4 Citações

COMPENDEX

Outras Informações

ID Authenticus: P-000-Y66

DOI: 10.1016/S0169-4332(00)00627-9

Abstract (EN): The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure, Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu3Sn phase begins at a temperature of about 473 K and that the Sn thickness (dSn) needed is slightly above 7 μm. Due to join wettability, higher temperatures (between 523 and 573 K) and dSn above 35 μm are required to form joins within the specifications of the electronic industry.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 4