Joining of TiAl using a thin multilayer

• Tipo: Resumo de Comunicação em Conferência Internacional
• Data: 2005

Autores

Liliana Duarte (Autor) FEUP; Manuel Vieira (Autor) FEUP; Filomena Viana (Autor) FEUP; Ana Sofia Ramos (Autor) Outra; Teresa Vieira (Autor) Outra

Ata de Conferência Internacional

Título: Materiais 2005

Materiais 2005 - III International Materials Symposium and XII Portuguese Materials Socitey Meeting

Universidade de Aveiro, 20 a 23 de Março de 2005

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia dos materiais

CORDIS: Ciências Tecnológicas > Engenharia

Outras Informações

Abstract (EN): As TiAl based alloys begin to approach maturity, the development of successful and cost effective joining methods will be required. The growing industrial interest in these materials, particularly in aerospace and automotive industry, led to an interesting challenge - how to joint parts and components in order to produce integrated and resistant structures. Diffusion bonding of materials produces components with thinner interfaces than other joining techniques do. The absence of abrupt microstructure discontinuity and the small deformation induced maximize joint strength. This work focuses on the joining of TiAl using a thin multilayer obtained by alternating nanometric layers of titanium and aluminium. The Ti/Al layers were deposited onto the -TiAl samples by DC magnetron sputtering. The interfaces of these diffusion bonded joints depend on processing and deposition conditions. In this work we describe the influence of bilayer thickness (period) and on microstructure and chemical composition of the joining interfaces.

Idioma: Português

Tipo (Avaliação Docente): Científica