Joining of TiAl using a thin multilayer

• Type: Summary of Presentation in an International Conference
• Date: 2005

Authors

Liliana Duarte (Author) FEUP; Manuel Vieira (Author) FEUP; Filomena Viana (Author) FEUP; Ana Sofia Ramos (Author) Other; Teresa Vieira (Author) Other

Conference proceedings International

Title: Materiais 2005

Materiais 2005 - III International Materials Symposium and XII Portuguese Materials Socitey Meeting

Universidade de Aveiro, 20 a 23 de Março de 2005

Scientific classification

FOS: Engineering and technology > Materials engineering

CORDIS: Technological sciences > Engineering

Other information

Abstract (EN): As TiAl based alloys begin to approach maturity, the development of successful and cost effective joining methods will be required. The growing industrial interest in these materials, particularly in aerospace and automotive industry, led to an interesting challenge - how to joint parts and components in order to produce integrated and resistant structures. Diffusion bonding of materials produces components with thinner interfaces than other joining techniques do. The absence of abrupt microstructure discontinuity and the small deformation induced maximize joint strength. This work focuses on the joining of TiAl using a thin multilayer obtained by alternating nanometric layers of titanium and aluminium. The Ti/Al layers were deposited onto the -TiAl samples by DC magnetron sputtering. The interfaces of these diffusion bonded joints depend on processing and deposition conditions. In this work we describe the influence of bilayer thickness (period) and on microstructure and chemical composition of the joining interfaces.

Language: Portuguese

Type (Professor's evaluation): Scientific