Reaction-Assisted Diffusion Bonding of Advanced Materials

• Type: Article in International Scientific Journal
• Date: 2010

Authors

A. S. Ramos (Author) Other; M. T. Vieira (Author) Other; S. Simões (Author) FEUP; F. Viana (Author) FEUP; M. F. Vieira (Author) FEUP

Journal

Title: Defect and Diffusion Forum

Pages: 972-977

ISSN: 1012-0386

Publisher: Trans Tech Publications Ltd

Indexing

Scopus

INSPEC

COMPENDEX

Scientific classification

FOS: Engineering and technology > Materials engineering

CORDIS: Technological sciences > Engineering

Other information

DOI: 10.4028/www.scientific.net/DDF.297-301.972

Abstract (EN): The aim of this work is to join γ-TiAl intermetallics to Ni based superalloys by solid state diffusion bonding. The surface of the γ-TiAl alloys and Ni superalloys to be joined was prepared by magnetron sputtering with a few microns thick Ni/Al reactive multilayer thin films with nanometric modulation periods. Sound joining without cracks or pores is achieved along the central region of the bond, especially at 800°C and when a 14 nm period Ni/Al film is used as filler material. During the diffusion bonding experiments interdiffusion and reaction inside the Ni/Al multilayer thin film and between the interlayer film and the base materials is promoted with the formation of intermetallic phases. The final reaction product in the multilayer films is the B2-NiAl intermetallic phase. The interfacial diffusion layers between the base materials and the multilayer films should correspond to: τ3- NiTiAl and τ4-Ni2TiAl phases from the γ-TiAl side; Ni-rich aluminide and σ-phase from the Inconel side. These intermetallic phases are responsible for the hardness increase observed on the diffusion layers.

Language: English

Type (Professor's evaluation): Scientific