Development of hermetic glass frit encapsulation for perovskite solar cells

• Tipo: Artigo em Revista Científica Internacional
• Data: 2019

Autores

Seyedali Emami (Autor) Outra; Jorge Martins (Autor) Outra; Ruben Madureira (Autor) Outra; Daniel Hernandez (Autor) Outra; Gabriel Bernardo (Autor) Outra; Joaquim Mendes (Autor) FEUP; Adélio Mendes (Autor) FEUP

Revista

Título: Journal of Physics D: Applied Physics

Vol. 52 Nº 7

Páginas: 1-19

ISSN: 0022-3727

Editora: Institute of Physics Publishing

Indexação

ISI Web of Knowledge - 18 Citações

Scopus

INSPEC

Projetos Associados

LEPABE-2-ECO-INNOVATION - LEPABE-2-ECO-INNOVATION

LEPABE - Laboratório de Engenharia de Processos, Ambiente, Biotecnologia e Energia

SunStorage - Recolha e armazenamento de energia solar

WINPSC - Novos avanços tecnológicos para a terceira geração de células solares sensibilizadas com perovskita

Outras Informações

ID Authenticus: P-00Q-15R

DOI: 10.1088/1361-6463/aaf1f4

Abstract (EN): A hermetic laser-assisted glass frit encapsulation, at a process temperature of 120 degrees C, was developed for perovskite solar cell application. The hermeticity and long-term stability of the sealing was examined based on standard tests for photovoltaic (PV) applications. Encapsulations using fluorine doped tin oxide (FTO)-coated glass substrates displayed 8.93 x 10(-8) atm center dot cm(3) center dot s(-1) air leak rate after five cycles of a humidity-freeze test according to the IEC61646 standard; a rate lower than the reject limit of the MIL-STD-883 standard test for fine leaks. Devices sealed with a TiO2 blocking layer and FTO scribing-denoted as an empty perovskite solar cell-showed that the encapsulation is compatible with the various thermal coefficient of expansion regions of perovskite solar cells (PSCs). The applicability of the MIL-STD-883 standard was studied in detail and it was concluded that a new method is required to measure the fine helium leak rate of devices with cavity sizes larger than 5.5 x 5.5 cm(2). The developed sealing process is scalable for larger devices; therefore, it guarantees a new step forward for the industrialization of PSCs.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 19