Development of hermetic glass frit encapsulation for perovskite solar cells

• Type: Article in International Scientific Journal
• Date: 2019

Authors

Seyedali Emami (Author) Other; Jorge Martins (Author) Other; Ruben Madureira (Author) Other; Daniel Hernandez (Author) Other; Gabriel Bernardo (Author) Other; Joaquim Mendes (Author) FEUP; Adélio Mendes (Author) FEUP

Journal

Title: Journal of Physics D: Applied Physics

Vol. 52 No. 7

Pages: 1-19

ISSN: 0022-3727

Publisher: Institute of Physics Publishing

Indexing

ISI Web of Knowledge - 18 Citations

Scopus

INSPEC

Associated Projects

LEPABE-2-ECO-INNOVATION - LEPABE-2-ECO-INNOVATION

LEPABE - Laboratório de Engenharia de Processos, Ambiente, Biotecnologia e Energia

SunStorage - Recolha e armazenamento de energia solar

WINPSC - Novos avanços tecnológicos para a terceira geração de células solares sensibilizadas com perovskita

Other information

Authenticus ID: P-00Q-15R

DOI: 10.1088/1361-6463/aaf1f4

Abstract (EN): A hermetic laser-assisted glass frit encapsulation, at a process temperature of 120 degrees C, was developed for perovskite solar cell application. The hermeticity and long-term stability of the sealing was examined based on standard tests for photovoltaic (PV) applications. Encapsulations using fluorine doped tin oxide (FTO)-coated glass substrates displayed 8.93 x 10(-8) atm center dot cm(3) center dot s(-1) air leak rate after five cycles of a humidity-freeze test according to the IEC61646 standard; a rate lower than the reject limit of the MIL-STD-883 standard test for fine leaks. Devices sealed with a TiO2 blocking layer and FTO scribing-denoted as an empty perovskite solar cell-showed that the encapsulation is compatible with the various thermal coefficient of expansion regions of perovskite solar cells (PSCs). The applicability of the MIL-STD-883 standard was studied in detail and it was concluded that a new method is required to measure the fine helium leak rate of devices with cavity sizes larger than 5.5 x 5.5 cm(2). The developed sealing process is scalable for larger devices; therefore, it guarantees a new step forward for the industrialization of PSCs.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 19