Numerical simulations of adhesive spreading during bonding-induced squeeze

• Tipo: Artigo em Revista Científica Internacional
• Data: 2021

Autores

Silva, LA (Autor) Outra; Espinosa, C (Autor) Outra; Paroissien, E (Autor) Outra; Lachaud, F (Autor) Outra; da Silva, LFM (Autor) FEUP

Revista

Título: Journal of Adhesion

Páginas: 1-33

ISSN: 0021-8464

Editora: Taylor & Francis

Indexação

ISI Web of Knowledge - 0 Citações

Scopus - 0 Citações

Outras Informações

ID Authenticus: P-00V-GD9

DOI: 10.1080/00218464.2021.1982388

Abstract (EN): The current work is intended to give an overview of issues related to the numerical simulation of adhesive spreading for liquid to semi-liquid adhesives. The advantages and limitations are presented in order to guide the choice of the suitable approach depending on the case under consideration. It is shown that methods are of two categories, whether they are grid-based or meshless. In the first, the movement of the matter is directly dependent on the mesh size and distribution. Contrariwise, in the meshfree methods, the particles are free to move and each carries its properties. Besides, cases of application are presented to provide a database for calculating adhesive spreading with the particulate SPH method. It is shown that it is possible to use simple behaviour laws to win this case.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 33