Stress-free temperature in a mixed-adhesive joint

• Tipo: Artigo em Revista Científica Internacional
• Data: 2006

Autores

Lucas F M Da Silva (Autor) FEUP; Adams, RD (Autor) Outra

Revista

Título: Journal of Adhesion Science and Technology

Vol. 20

Páginas: 1705-1726

ISSN: 0169-4243

Editora: Taylor & Francis

Indexação

ISI Web of Knowledge - 45 Citações

Scopus - 57 Citações

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia química

Outras Informações

ID Authenticus: P-004-Q20

DOI: 10.1163/156856106779024436

Abstract (EN): Adhesive joints used in supersonic aircraft fuselage need to withstand low (-55 degrees C), as well as high (200 degrees C) temperatures. However, there are no adhesives suitable for the whole temperature range. A solution would be a joint with a combination of a low-temperature adhesive and a high-temperature adhesive, called a mixed-adhesive joint. In a bonded joint, the thermal stresses are generated essentially by the different thermal expansion properties of the adhesive and the adherends and, to a lesser extent, by the shrinkage of the adhesive produced by curing. The case of a mixed-adhesive joint is more complicated because there are two adhesives with different glass transition temperatures (T-g). To determine the stress-free temperature in a mixed adhesive joint, sandwich specimens of aluminium-adhesive-CFRP (carbon-fibre-reinforced plastic) were fabricated and the thermal strains were measured with strain gauges. In a mixed adhesive joint, two stress-free temperatures were found: the stress-free temperature of the high temperature adhesive, which is its cure temperature, and the stress-free temperature of the low temperature adhesive, which is its T-g..

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 22