Diffusion Bonding of TiAl to Ti6Al4V Using Nanolayers

• Tipo: Artigo em Revista Científica Internacional
• Data: 2018

Autores

Sónia Simões (Autor) FEUP; Filomena Viana (Autor) FEUP; A. Sofia Ramos (Autor) Outra; M. Teresa Vieira (Autor) Outra; Manuel F. Vieira (Autor) FEUP

Revista

Título: Journal of Materials Engineering and Performance

Vol. 27 Nº 10

Páginas: 5064-5068

ISSN: 1059-9495

Editora: Springer Nature

Indexação

ISI Web of Knowledge - 6 Citações

Scopus - 7 Citações

INSPEC

Outras Informações

ID Authenticus: P-00N-V63

DOI: 10.1007/s11665-018-3207-z

Abstract (EN): Microstructural characterization of TiAl to Ti6Al4V dissimilar diffusion bonds assisted by reactive Ni/Al nanolayers was performed in this study. The nanolayers (alternated Al and Ni) were deposited onto the base material surfaces. Diffusion bonding was performed at 700 and 800 degrees C under pressures from 5 to 40MPa and dwell times between 60 and 180min. Microstructural characterization was performed using high-resolution transmission and scanning electron microscopies. The observations revealed that dissimilar TiAl to Ti6Al4V joints assisted by Ni/Al reactive nanolayers can be obtained successfully at 800 degrees C during 60min using a pressure of 20MPa. The bond interface is thin (less than 10 mu m) and is mainly composed of NiAl grains. Thin layers of Al-Ni-Ti intermetallic compounds were formed adjacent to the base materials.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 5