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Microelectronic and Microelectromechanical Technologies
| Code: | PRODEF033 | Acronym: | TMM |
| Keywords | |
|---|---|
| Classification | Keyword |
| OFICIAL | Electrical and Computer Engineering |
Instance: 2023/2024 - 1S 
| Active? | Yes |
| Responsible unit: | Department of Electrical and Computer Engineering |
| Course/CS Responsible: | Doctoral Program in Engineering Physics |
Cycles of Study/Courses
| Acronym | No. of Students | Study Plan | Curricular Years | Credits UCN | Credits ECTS | Contact hours | Total Time |
|---|---|---|---|---|---|---|---|
| PRODEF | 6 | Syllabus since 2009/2010 | 1 | - | 6 | 28 | 162 |
Teaching language
Portuguese and englishObjectives
The objective of this CU is to develop the background knowledge necessary to understand the state-of-the-art of
semiconductor and MicroElectro Mechanical Systems (MEMS) technologies, as well as the issues of integrating
mechanical elements and electronics. A comprehensive, semester-long project is assigned, comprising the design of a sensor and the electronic frontend.
This process requires the understanding of analogue design
techniques as well as the basic design-flow used in the fabrication of MEMS devices, providing the integrated view of a MEMS-based sensor and analog frontend design. The basic concepts and circuits for global noise reduction and interface between MEMS-analogueand digital worlds, both at the circuit level and design methodologies, are also addressed for the understanding of the fundamental aspects associated with full system integration.
semiconductor and MicroElectro Mechanical Systems (MEMS) technologies, as well as the issues of integrating
mechanical elements and electronics. A comprehensive, semester-long project is assigned, comprising the design of a sensor and the electronic frontend.
This process requires the understanding of analogue design
techniques as well as the basic design-flow used in the fabrication of MEMS devices, providing the integrated view of a MEMS-based sensor and analog frontend design. The basic concepts and circuits for global noise reduction and interface between MEMS-analogueand digital worlds, both at the circuit level and design methodologies, are also addressed for the understanding of the fundamental aspects associated with full system integration.
Learning outcomes and competences
It is intended that the student ia able to understand the state of the art of semiconductor technologies and MEMS systems, to design a sensor design and its reading circuits, to understand analog design techniques, as well as the design flow used in manufacturing MEMS devices, and master the basics concepts and circuits for global noise reduction and interface between the MEMS-analog and digital universe.Working method
PresencialProgram
MEMS Design:- Introduction to MEMS: Main physical concepts: piezoresistivity, piezoelectricity, capacitive transduction.
- MEMS device basics
- Modeling, design and MEMS fabrication process.
CMOS Design:
- Physics of the MOSFET – Modeling
- Technology rules and layout.
- Basic Analog Cells Introduction.
- Voltage and current reference cells.
- Current mirrors – Active loads
- CMOS amplifier analysis: single ended and fully differential
- Noise definitions, noise sources in circuits and analysis.
- Analog vs discretetimereadchain.
- Lownoise design: Charge Amplifier design and Chopper stabilization.
- Switched Capacitor (SC) circuits.
- Clock Feedthrough (CFT): noise, offset, nonlinearity.
- SC Filters synthesis.
- GmC Filters (synthesis).
- A/D and D/A converters figures of merit.
- Converter types with emphasis on SigmaDelta.
Mandatory literature
Phillip E. Allen; CMOS analog circuit design. ISBN: 0-19-511644-5R. Jacob Baker; CMOS circuit design, layout, and simulation. ISBN: 0-7803-3416-7
David Johns; Analog integrated circuit design. ISBN: 0-471-14448-7
Stephen D. Senturia; Microsystem Design, 2001. ISBN: 978-0-306-47601-3
Behzad Razavi; Design of Analog CMOS Integrated Circuits. ISBN: 978-0072380323
Teaching methods and learning activities
This curricular unit combines lecture and project work to provide students with a practical, handson approach to microelectronics and microelectromechanical systems (MEMS) technologies and systems conception. The lecture classes will take about half of the direct contact time, and will cover three main modules: MEMS sensors and actuators, Microelectronic principles, and Signal conditioning and interfacing.
Type of assessment: Distributed without final examination.
Final grade=0.3*Homework + 0.3*Project + 0.2*First Midterm
Exam + 0.2*Second Midterm Exam
Evaluation Type
Distributed evaluation without final examAssessment Components
| Designation | Weight (%) |
|---|---|
| Teste | 40,00 |
| Trabalho escrito | 30,00 |
| Trabalho prático ou de projeto | 30,00 |
| Total: | 100,00 |
Amount of time allocated to each course unit
| Designation | Time (hours) |
|---|---|
| Trabalho escrito | 49,00 |
| Trabalho laboratorial | 49,00 |
| Estudo autónomo | 47,00 |
| Frequência das aulas | 17,00 |
| Total: | 162,00 |
Eligibility for exams
Does not applyCalculation formula of final grade
Final grade=0.3*Homework + 0.3*Project + 0.2*First Midterm Exam + 0.2*Second Midterm Exam
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Page generated on: 2025-06-25 at 03:37:59 | Acceptable Use Policy | Data Protection Policy | Complaint Portal