Microelectronic and Microelectromechanical Technologies

Code:

PDEEC0009

Acronym:

MMT

Keywords
Classification	Keyword
OFICIAL	Electronics and Digital Systems

Instance: 2011/2012 - 1S

Active?	Yes
Web Page:	moodle.fe.up.pt
Responsible unit:	Department of Electrical and Computer Engineering
Course/CS Responsible:	Doctoral Program in Electrical and Computer Engineering

Cycles of Study/Courses

Acronym	No. of Students	Study Plan	Curricular Years	Credits UCN	Credits ECTS	Contact hours	Total Time
PDEEC	3	Syllabus since 2007/08	1	-	7,5	70	200

Teaching language

English

Objectives

The objective of this course is to develop the background knowledge necessary to understand the state-of-the-art of semiconductor and Micro-Electro Mechanical Systems (MEMS) technologies, as well as the issues of integrating mechanical elements and electronics. It requires the understanding of analogue design techniques as well as the basic design-flow used in the fabrication of MEMS devices. The basic concepts and circuits, for global noise reduction and interface between MEM-analogue and digital worlds, both at the circuit level and design methodologies, are also addressed for the understanding of the fundamental aspects associated with full systems integration.

Learning outcomes and competences

.

Working method

Presencial

Program

The first Module, Microelectronic principles, will cover the technology foundations of semiconductors, where the MOS fabrication process, the PN junction, BJT and the MOS transistor will be discussed. The first module will also discuss device modeling (MOS models, interconnect loading and transistor noise) and advanced amplifier design. Here buffered Opamps, fully differential amplifiers, high-speed amplifiers, low-noise amplifiers and circuit design for low-power and low-voltage will be presented. Finally, the module will cover the topic of non-linear electronics focusing on comparators and translinear circuits. The second module, MEMS sensors and actuators, focuses on Micro-Electro Mechanical Systems (MEMS) and the integration of mechanical elements and electronics. Initially, MEMS fabrication techniques will be discussed (Etching, bulk micromachining and surface micromachining). Then the principal MEMS device concepts will be discussed with focus on pressure, inertial and flow sensors and microactuators. Finally the aspects related to design, simulation tools and modelling of MEMS will be presented. Lumped modelling, mechanical, coupled electromechanical, thermal and squeeze-film damping models will be discussed. The third and final module, deals with signal conditioning and interfacing. The aspects relating to signal conditioning are discussed: noise sources, input stages, low noise circuit techniques, filters and sampling. The analogue to digital interface is also covered with respect to, Analog-to-digital converters and mixed signal design. Here, the problems concerned with high-speed I/O are also referred with focus on the design of mixed-signal with high-frequency digital signals (clock signals). Course Outline Module I: Microelectronic principles. 1- Technology foundations. i. MOS Semiconductor fabrication process. ii. PN junction and BJT. iii. MOS transistor. 2- Device modelling. i. MOS models. ii. Interconnect loading. iii. Transistor noise. 3- Advanced amplifier design. i. Buffered OpAmps. ii. Fully differential amplifiers. iii. High speed amplifiers. iv. Circuit design for low-power and low-voltage. v. Low-noise amplifiers. 4- Non-linear electronics. i. Comparators. ii. Translinear circuits. Module II: MEMS: Sensors and actuators. 1- MEMS fabrication techniques. i. Etching. ii. Bulk micromachining. iii. Surface micromachining. 2- MEMS device concept. i. Pressure, inertial and flow sensors. ii. Microactuators. 3- Design and simulation tools for MEMS. 4- Modelling MEMS. i. Lumped modelling. ii. Mechanical, coupled electromechanical and thermal models. iii. Squeeze-film damping modelling. Module III: Signal conditioning and interfacing. 1- Signal conditioning. i. Noise sources. ii. Input Stages. iii. Low noise circuit techniques. iv. Filters.

Mandatory literature

Allen, Phillip E.; CMOS analog circuit design. ISBN: 0-19-511644-5
Baker, R. Jacob; CMOS circuit design, layout, and simulation. ISBN: 0-7803-3416-7
Johns, David; Analog integrated circuit design. ISBN: 0-471-14448-7

Teaching methods and learning activities

This course will combine lecture and project work to provide students with a practical, hands-on approach to microelectronics and micro-electro-mechanical systems (MEMS) technologies and systems conception. The lecture classes will take about half of the direct contact time, and will cover three main modules: Microelectronic principles, MEMS sensors and actuators and Signal conditioning and interfacing.

Evaluation Type

Distributed evaluation with final exam

Assessment Components

Description	Type	Time (hours)	Weight (%)	End date
Attendance (estimated)	Participação presencial	42,00
Final exam	Exame	3,00	1,00
Study	Trabalho de campo		99,00
	Total:	-	100,00

Eligibility for exams

According the currently specified rules.

Calculation formula of final grade

Final mark=0,3*Assignments + 0,3*Project + 0,2*MidtermExam + 0,2*FinalExam

Examinations or Special Assignments

Not foreseen.

Special assessment (TE, DA, ...)

Not foreseen.

Classification improvement

Not foreseen.