Creep behaviour of adhesively bonded joints: A comprehensive review

• Type: Another Publication in an International Scientific Journal
• Date: 2024

Authors

Neto, RMC (Author) Other; Akhavan-Safar, A (Author) Other; Sampaio, EM (Author) Other; Simoes, BD (Author) Other; Vignoli, LL (Author) Other; da Silva, LFM (Author) FEUP

Journal

Title: Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

ISSN: 1464-4207

Publisher: SAGE

Indexing

ISI Web of Knowledge - 0 Citations

Scopus

Other information

Authenticus ID: P-010-2JW

DOI: 10.1177/14644207241233889

Abstract (EN): This review paper provides an exploration of various facets of creep behaviour in adhesives and adhesive joints, encompassing experimental procedures, prediction models, influential parameters and strategies to enhance resistance. The discussion extends to the interplay between fatigue and creep, emphasising recent advances over the last two decades. While avoiding redundancy with prior work on temperature and moisture degradation, the paper articulates connections between topics for a better understanding. A critical examination of load levels reveals that small variations significantly impact the creep life of adhesive joints, particularly prominent with epoxy adhesives. The adhesive type, joint geometry and substrate material are scrutinised, revealing distinct impacts on creep behaviour. The study underscores the critical role of adhesive thickness and overlap length, emphasising their relevance in determining the time to failure in bonded joints under creep conditions. Notably, the substrate material's role is highlighted. As the review delves into unexplored dimensions, it calls for further research to bridge existing gaps and refine our understanding of tertiary creep and time until failure.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 26