Creep deformation simulation of adhesively bonded joints at different temperature levels using a modified power-law model

• Type: Article in International Scientific Journal
• Date: 2019

Authors

M. A. Saeimi Sadigh (Author) Other; B. Paygozar (Author) Other; Lucas F. M. da Silva (Author) FEUP; F. Vakili Tahamid (Author) Other

Journal

Title: Polymer Testing

Vol. 79

Pages: 1-6

ISSN: 0142-9418

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 0 Citations

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Scopus - 5 Citations

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Other information

Authenticus ID: P-00R-0C5

DOI: 10.1016/j.polymertesting.2019.106087

Abstract (EN): Adhesively bonded joints are widely used in engineering domains due to their capability to withstand different thermal and mechanical loads. In this paper, creep deformations of double lap adhesive joints under mechanical and thermal loads are investigated experimentally and numerically. For this aim, specimens of bulk adhesive are utilized in order to investigate the creep behavior and constitutive parameters of the material. The Power-law model is improved and used to simulate the creep behavior of the adhesive at a variety of stress and temperature levels. The modified model is defined in ABAQUS with a user defined subroutine UMAT written in FORTRAN, in order to simulate the creep deformations of the joints through finite element-based numerical analyses. In order to verify the accuracy of the finite element process, three double lap specimens with aluminum adherends are tested under several stress and temperature levels, and creep deformations are also measured. The results show that applying the modified Power-law model can accurately predict the creep deformations of the adhesively bonded joints. © 2019 Elsevier Ltd

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 6