Abstract (EN):
Constructing a new device we had to design some vapour-cooled current leads. This cur-rent leads are made of Low-Tc material connected with copper wires and some parts of High-Tc material. Its design is calculated keeping in mind the heat transfer by diffusion to a vapour-cooled stream that surrounds the conductive materials. The design and the calculations performed to achieve it, and also the background theory of the heat diffusion applied in this part of the device will be described.
Idioma:
Inglês
Tipo (Avaliação Docente):
Científica
Contacto:
pauloaugusto@ieee.org; tcg@fe.up.pt; dbarbosa@fe.up.pt; estevez@usal.es
Nº de páginas:
6