Numerical simulations of adhesive spreading during bonding-induced squeeze

• Type: Article in International Scientific Journal
• Date: 2021

Authors

Silva, LA (Author) Other; Espinosa, C (Author) Other; Paroissien, E (Author) Other; Lachaud, F (Author) Other; da Silva, LFM (Author) FEUP

Journal

Title: Journal of Adhesion

Pages: 1-33

ISSN: 0021-8464

Publisher: Taylor & Francis

Indexing

ISI Web of Knowledge - 0 Citations

Scopus - 0 Citations

Other information

Authenticus ID: P-00V-GD9

DOI: 10.1080/00218464.2021.1982388

Abstract (EN): The current work is intended to give an overview of issues related to the numerical simulation of adhesive spreading for liquid to semi-liquid adhesives. The advantages and limitations are presented in order to guide the choice of the suitable approach depending on the case under consideration. It is shown that methods are of two categories, whether they are grid-based or meshless. In the first, the movement of the matter is directly dependent on the mesh size and distribution. Contrariwise, in the meshfree methods, the particles are free to move and each carries its properties. Besides, cases of application are presented to provide a database for calculating adhesive spreading with the particulate SPH method. It is shown that it is possible to use simple behaviour laws to win this case.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 33