EFFECT OF CURE TEMPERATURE ON THE GLASS TRANSITION TEMPERATURE OF AN EPOXY ADHESIVE

• Tipo: Artigo em Livro de Atas de Conferência Internacional
• Data: 2012

Autores

Carbas, RJC (Autor) Outra; Marques, EAS (Autor) FEUP; António Mendes Lopes (Autor) FEUP; da Silva, LFM (Autor) FEUP

Ata de Conferência Internacional

Título: Proceedings ICEM15 - 15th International Conference on Experimental Mechanics

ICEM15 - 15th International Conference on Experimental Mechanics

Porto, 22-27 July 2012

Indexação

ISI Web of Knowledge - 1 Citação

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia mecânica

Outras Informações

ID Authenticus: P-005-K2T

Abstract (EN): This work was undertaken to improve the understanding of the effect of curing temperature in the glass transition temperature, Tg, of an epoxy adhesive. The curing process was the same for all tests, consisting of a curing stage followed by a post cure stage. The initial stage was performed at different temperatures while the post curing stage was always performed at room temperature until the adhesive was completely cured. T-g was found to vary as a function of the cure temperature of the adhesive. When cured below the glass transition temperature of the fully cured network, T-g infinity, the T-g is lower than the cure temperature. When cured above T-g infinity, the T-g is higher than the cure temperature.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 2