Characterizing the intermetallic formed during ball attach process

• Type: Another Publication in an International Scientific Journal
• Date: 2008

Authors

Paulo Pereira (Author) FEUP; Santos, R (Author) Other; Maria M Barbosa (Author) Other; Catia Almeida (Author) Other

Journal

Title: Microscopy and Microanalysis

Vol. 14 No. S3

Pages: 17-18

ISSN: 1431-9276

Publisher: Cambridge University Press

Indexing

ISI Web of Knowledge - 0 Citations

Scopus - 0 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

Other information

Authenticus ID: P-003-WPC

DOI: 10.1017/s1431927608089253

Abstract (EN): Continuously miniaturization of electronic components using PCB's technology for the manufacturing of SDRAM's uses a solder ball attach process, producing a joint which robustness and electrical response are crucial factors to success. At present, near-eutectic Sn-Ag-Cu alloys are the leading candidates for Pb-free solders. According to Chun et al., the rapid formation of Cu-Sn intermetallic compounds at the interface affects the reliability of this solder joint and represents a major concern. In this study we characterize the interface of an attachment between the copper layer conductors of a memory and a solder ball which allows further bonding to printed circuit modules, see figure 1.a. © 2008 Microscopy Society of America.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 2