Low temperature hermetic laser-assisted glass frit encapsulation of soda-lime glass substrates

• Type: Article in International Scientific Journal
• Date: 2017-05-12

Authors

Seyedali Emami (Author) FEUP; Jorge Martins (Author) FEUP; Luísa Andrade (Author) FEUP; Joaquim Mendes (Author) FEUP; Adélio Mendes (Author) FEUP

Journal

Title: Optics and Lasers in Engineering

Vol. 96

Pages: 107-116

ISSN: 0143-8166

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 14 Citations

ISI Web of Science

Scopus - 14 Citations

INSPEC

Associated Projects

BI-DSC - Building Integrated Dye Sensitized Solar Cells

GOTSolar - New technological advances for the third generation of Solar cells

LEPABE-2-ECO-INNOVATION - LEPABE-2-ECO-INNOVATION

Other information

Authenticus ID: P-00M-SM6

DOI: 10.1016/j.optlaseng.2017.04.006

Abstract (EN): Room temperature and low temperature (120 degrees C) laser-assisted glass frit bonding of soda-lime glass substrates are accomplished in this work. The locally laser melted bonding showed hermeticity with helium leak rate of < 5 x 10(-8) atm cm(3) s(-1), maintaining its leak rate even after standard climatic cycle tests. Small size devices were bonded at room temperature while larger areas were sealed at the process temperature of 120 degrees C. The sealing parameters were optimized through response surface methodology that makes the process capable for further development regardless of device size.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 10