New metallurgical systems for electronic soldering applications

• Tipo: Artigo em Revista Científica Internacional
• Data: 1999

Autores

José Inácio Martins (Autor) FEUP; A. P. Marvão (Autor) Outra; C. Gonçalves (Autor) Outra; E. Fortunato (Autor) Outra; I. Ferreira (Autor) Outra; J. Ferreira (Autor) Outra; R. Martins (Autor) Outra; R. Oppelt (Autor) Outra; T. Harder (Autor) Outra

Revista

Título: Sensors and Actuators, A: Physical

Vol. 74

Páginas: 70-76

ISSN: 0924-4247

Editora: Elsevier

Indexação

ISI Web of Knowledge - 5 Citações

ISI Web of Science

Scopus - 5 Citações

COMPENDEX

Classificação Científica

FOS: Ciências da engenharia e tecnologias

Outras Informações

ID Authenticus: P-001-4KG

DOI: 10.1016/s0924-4247(98)00305-7

Abstract (EN): The aim of this paper is to present results on a new soldering process based on the low-temperature solidification of intermetallic phases from the system Cu-Sn-Cu which can be employed to form a heat-resistant die-attach as well as signal and power electric contacts. Because of the total transformation into intermetallic phase, the working temperature of the bond formed is several hundred degrees Celsius higher than the process temperature (around 250 degrees C). This process leads to a homologous temperature T/T(m) of about 0.3 compared to 0.7 in the case of soft SnAg solder alloy. Therefore a better reliability of the proposed bonding process is achievable. Results of the match of the predicted volume fraction of the intermetallic forms and the experimentally measured contact volume would be also discussed, for contacts formed in power diodes.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 7