Tensile Behaviour of a Structural Adhesive at High Temperatures by the eXtended Finite Element Method

• Tipo: Artigo em Revista Científica Internacional
• Data: 2013

Autores

Campilho, RDSG (Autor) Outra; Banea, MD (Autor) FEUP; da Silva, LFM (Autor) FEUP

Revista

Título: Journal of Adhesion

Vol. 89

Páginas: 529-547

ISSN: 0021-8464

Editora: Taylor & Francis

Indexação

ISI Web of Knowledge - 6 Citações

Scopus - 10 Citações

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia química

Outras Informações

ID Authenticus: P-004-ZSD

DOI: 10.1080/00218464.2013.768106

Abstract (EN): Component joining is typically performed by welding, fastening, or adhesive-bonding. For bonded aerospace applications, adhesives must withstand high-temperatures (200 degrees C or above, depending on the application), which implies their mechanical characterization under identical conditions. The extended finite element method (XFEM) is an enhancement of the finite element method (FEM) that can be used for the strength prediction of bonded structures. This work proposes and validates damage laws for a thin layer of an epoxy adhesive at room temperature (RT), 100, 150, and 200 degrees C using the XFEM. The fracture toughness (G Ic ) and maximum load (); in pure tensile loading were defined by testing double-cantilever beam (DCB) and bulk tensile specimens, respectively, which permitted building the damage laws for each temperature. The bulk test results revealed that decreased gradually with the temperature. On the other hand, the value of G Ic of the adhesive, extracted from the DCB data, was shown to be relatively insensitive to temperature up to the glass transition temperature (T g ), while above T g (at 200 degrees C) a great reduction took place. The output of the DCB numerical simulations for the various temperatures showed a good agreement with the experimental results, which validated the obtained data for strength prediction of bonded joints in tension. By the obtained results, the XFEM proved to be an alternative for the accurate strength prediction of bonded structures.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 19