Developments in diffusion bonding and brazing of advanced materials

• Tipo: Artigo em Livro de Atas de Conferência Internacional
• Data: 2010

Autores

Vieira, MF (Autor) FEUP; Vieira, MT (Autor) Outra; Ramos, AS (Autor) Outra; Simoes, S (Autor) FEUP; Viana, F (Autor) FEUP

Ata de Conferência Internacional

Título: Proc. of the Int. Conf. on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conj. with the 63rd Annual Assembly of IIW 2010

Páginas: 317-323

International Conference on Advances in Welding Science and Technology for Construction, Energy and Transportation, AWST 2010, held in Conjunction with the 63rd Annual Assembly of the International Institute of Welding, IIW 2010

Istanbul, 11 July 2010 through 17 July 2010

Indexação

ISI Web of Knowledge

Scopus - 0 Citações

Classificação Científica

CORDIS: Ciências Tecnológicas > Engenharia > Engenharia de materiais

Outras Informações

ID Authenticus: P-007-XSG

Abstract (EN): The development of joining technologies for advanced materials is fundamental to integrate them into functional structures and to widen their application field. Solid-state diffusion bonding and diffusion brazing are two straightforward techniques for producing sound and reliable joints. To assist in the joining process it is possible to introduce interlayers between the materials to be joined. These interlayers are usually pure and soft metals, introduced as thick or thin foils. Multi and gradient thin layers are a new attractive approach to join advanced materials: the high reactivity and diffusivity of nanocrystalline layers allow combining the advantages of diffusion bonding with "low" processing pressure and temperature. In addition, adequate thin layers minimize residual stresses originated mainly from different coefficients of thermal expansion. The innovative aspect relies on the use of sputtered nanometallic multilayers to enhance the bonding mechanisms. Me/Al multilayer thin films (Me=Ti, Ni) with nanometric periods were used as filler alloys to join titanium aluminides to itself, to superalloys and steels. During bonding the multilayers evolve to a nanostructered interlayer of intermetallic phases. The multilayer period influences the bond quality and strength. An assemblage of Me/Al nano structured reactive multilayered with thin foils (Ti and Ni) was also tested. This technique, that combines the advantages of diffusion brazing with low temperatures, can be applied for joining temperature sensitive materials and components. The trend towards miniaturization in materials area may also take advantage from these joining procedures due to their ability to tailor interlayers composition and thickness.

Idioma: Inglês

Tipo (Avaliação Docente): Científica