Simulation

• Tipo: Capítulo ou Parte de Livro
• Data: 2020

Autores

Akhavan-Safar A. (Autor) Outra; Marques, EAS (Autor) FEUP; Ricardo Carbas (Autor) FEUP; da Silva, LFM (Autor) FEUP

Livro

Título: Advanced Joining Processes: Welding, Plastic Deformation, and Adhesion

Páginas: 319-351

ISBN Eletrónico: 9780128207871

Indexação

Scopus - 0 Citações

Outras Informações

ID Authenticus: P-00X-6AP

DOI: 10.1016/b978-0-12-820787-1.00009-7

Abstract (EN): Adhesive bonding, as a flexible and efficient joining method, has been extensively adopted in industrial applications where a combination of light weight and high mechanical performance structures are demanded. However, the design of these joints is not simple, as bonded connections experience a variety of loading and environmental conditions during their service life. In this chapter, several approaches developed and considered by authors for simulation of adhesive joint behavior under different ambient and loading conditions, are discussed. After a short introduction, the cohesive zone modeling (CZM) which is developed and considered in several works, is introduced. In the first section the quasi static analysis of adhesive joints based on CZM and also extended finite element method (XFEM) are discussed. Simulation of the joints behavior under cyclic loading is the second part of this chapter where simulation of the degradation of cohesive properties of adhesive materials subjected to cyclic loading is considered. Simulation of the joints under high strain rate and impact loading is explained in the third section of this chapter. Numerical analyses of the adhesives aged by moist environment are presented in the last section.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 32