Effect of mechanical properties and geometric dimensions on electromechanical impedance signatures for adhesive joint integrity monitoring

• Tipo: Artigo em Revista Científica Internacional
• Data: 2022

Autores

Tenreiro, AFG (Autor) Outra; António Mendes Lopes (Autor) FEUP; da Silva, LFM (Autor) FEUP; Amorim, JDP (Autor) Outra

Revista

Título: Mechanics of Advanced Materials and Structures

Páginas: 1-16

ISSN: 1537-6494

Editora: Taylor & Francis

Indexação

ISI Web of Knowledge - 6 Citações

Scopus - 6 Citações

Outras Informações

ID Authenticus: P-00W-5J3

DOI: 10.1080/15376494.2022.2033891

Abstract (EN): Adhesive joints are prone to damage, which may be difficult to detect using Nondestructive Test. Structural Health Monitoring techniques, such as the Electromechanical Impedance Spectroscopy (EMIS), allow for continuous monitoring and early detection of structural defects. Developing efficient damage detection algorithms requires simulations of adhesive structures, which require elastic and damping properties under high frequency range. Tests were performed for crash-resistant and silicone adhesives. Numerical simulations with said properties were compared with experimental impedance measurements from Single Lap Joints (SLJ). This allowed for the estimation of adhesive properties, but numerical results for SLJs with silicone adhesive diverged from experimental results.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 16