Morphology of copper coatings electroplated in an ultrasonic field

• Tipo: Artigo em Revista Científica Internacional
• Data: 2004

Autores

L. Martins (Autor) Outra; José Inácio Martins (Autor) FEUP; A. S. Romeira (Autor) Outra; M. E. Costa (Autor) Outra; J. Costa (Autor) Outra; M. Bazzaoui (Autor) Outra

Revista

Título: ADVANCED MATERIALS FORUM II

Vol. 455-456

Páginas: 844-848

Editora: Trans Tech Publications Ltd

Indexação

ISI Web of Knowledge - 12 Citações

ISI Web of Science

Scopus - 14 Citações

Outras Informações

ID Authenticus: P-000-C66

DOI: 10.4028/www.scientific.net/MSF.455-456.844

Abstract (EN): This paper reports the study of ultrasonic effects on some physicochemical properties of electroplated copper on iron subtracts from an acid sulphate bath. The bath efficiency for three stirring processes has been also studied as a function of the time and the current density applied. The bath efficiency, the hardness, the brightness and the adherence of the electrodeposits increase with the ultrasonic agitation, in comparison with the same coatings produced from still or magnetic stirred baths. Scanning electron microscopy (SEM) analysis has revealed a compact and more order structure in the coatings performed under ultrasonic waves at high current densities, conversely to free and dusty obtained with still bath.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 5