Electrodeposition of Mn and Mn-Sn Alloy Using Choline Chloride-Based Ionic Liquids

• Tipo: Artigo em Revista Científica Internacional
• Data: 2017

Autores

Nuno Pereira (Autor) FCUP; Carlos M Pereira (Autor) FCUP; araujo, j. p. (Autor) FCUP; Silva, F (Autor) FCUP

Revista

Título: Journal of the Electrochemical Society

Vol. 164 Nº 2

Páginas: D486-D492

ISSN: 0013-4651

Editora: Electrochemical Society, Inc.

Indexação

ISI Web of Knowledge - 8 Citações

Scopus - 8 Citações

Outras Informações

ID Authenticus: P-00R-3HE

DOI: 10.1149/2.1421707jes

Abstract (EN): The deposition of Mn and Mn-Sn alloy from two deep eutectic solvents (DES) was investigated. Pure Mn deposits were powdery and amorphous regardless the DES used. In contrast, the manganese-tin deposits obtained from the two DES used were adherent. The morphology of the deposits obtained from the different DES was analyzed by SEM, which showed that pure Mn films were fibrous. The morphology of Mn-Sn deposits changed upon changing on the amount of tin in solution or the DES used. The phase composition of the Mn-Sn films were investigated by X-Ray diffraction, which showed that the deposits were formed by different MnxSny intermetallic phases. The metallic content in the deposit changed upon changing the bath composition or the DES used. Using the urea (U) based DES Mn-Sn deposits with a Sn content between 1.8 and 6.7 wt% were obtained. In contrast, using the ethylene glycol (EG) based DES the Sn content in the deposits varied between 33.2 and 59.0 wt%.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 7