TiAl diffusion bonding using Ni/Ti multilayers

• Tipo: Artigo em Revista Científica Internacional
• Data: 2017

Autores

Simoes, S (Autor) FEUP; Sofia Ramos, AS (Autor) Outra; Filomena Viana (Autor) FEUP; Teresa Vieira, MT (Autor) Outra; Vieira, MF (Autor) FEUP

Revista

Título: Welding in the World, Le Soudage Dans Le Monde

Vol. 61

Páginas: 1267-1273

ISSN: 0043-2288

Editora: Springer Nature

Indexação

ISI Web of Knowledge - 10 Citações

Scopus - 11 Citações

Outras Informações

ID Authenticus: P-00M-YPB

DOI: 10.1007/s40194-017-0507-0

Abstract (EN): Diffusion bonding of TiAl using reactive Ni/Ti multilayers was studied in this investigation. Alternated Ni and Ti layers were sputter deposited onto TiAl base material. These multilayers can be used to improve the diffusion bonding, since they increase the diffusivity at the interface. Bonding experiments were performed at 700 and 800 degrees C under a pressure of 10-50 MPa with a bonding time of 60 min. The interfaces were characterized by high-resolution scanning and transmission electron microscopies. Microstructural characterization reveals that joints can be obtained successfully with Ni/Ti multilayers. The interfaces exhibit slightly different microstructures depending on the bonding temperature and the multilayer bilayer thickness. For all joints, these are mainly composed of equiaxed grains of NiTi and NiTi2. The best mechanical response was achieved for joints processed at 800 degrees C for 60 min under a pressure of 10 MPa using Ni/Ti multilayers with 30 nm bilayer thickness, which exhibit a shear strength of 288 MPa.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 7