Study of the bonding performance of UF/PVAc formulations with low formaldehyde emission

• Tipo: Artigo em Livro de Atas de Conferência Internacional
• Data: 2012-04-25

Autores

Luísa Carvalho (Autor) FEUP; João Ferra (Autor) Outra; Jorge Martins (Autor) Outra; Nuno Costa (Autor) Outra; Cristina Coelho (Autor) FEUP; João Pereira (Autor) Outra; Paulo Cruz (Autor) Outra

Ata de Conferência Internacional

Título: 1st Workshop of COST - Basics for Chemistry of Wood Surface Modification"

Páginas: 60-62

Outras Informações

Abstract (EN): Urea-formaldehyde resins are still the most widely used adhesives in the manufacture of woodbased panels. However, environmental requirements, as stringent formaldehyde emissions regulations, and new products specifications, have forced producers to find new tailor-made gluing solutions, without loosing productivity and quality. Three approaches currently been followed: optimization of UF resin synthesis, development of new catalysis systems and the combination of high performance UF resins with added chemical formaldehyde scavengers [1]. Another alternative is the formulation of two components systems, mixing a UF resin with a formaldehyde free adhesive, as PVAc (Polyvinyl Acetate Adhesive), an aqueous dispersion of polyvinyl acetate compatible with UF. PVAc based glues are very common in the furniture and joinery applications, because they are very easy to handle and apply and they have a long storage life. However, due to their characteristics, as the low moisture resistance and creep (thermoplasticity), the common PVAc adhesives are restricted to non-structural and interior applications [2]. Modified PVAc glues with the addition of crosslinkers allowed this type of glues to be used in water resistance classes D2 to D4 according to EN 204 standard [3].

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 3