Reaction-assisted diffusion bonding of advanced materials

• Tipo: Artigo em Livro de Atas de Conferência Internacional
• Data: 2010

Autores

Ramos, AS (Autor) Outra; Vieira, MT (Autor) Outra; Simoes, S (Autor) FEUP; Viana, F (Autor) FEUP; Vieira, MF (Autor) FEUP

Ata de Conferência Internacional

Título: Defect and Diffusion Forum

Páginas: 972-977

Indexação

Scopus - 10 Citações

Classificação Científica

CORDIS: Ciências Tecnológicas > Engenharia > Engenharia de materiais

FOS: Ciências da engenharia e tecnologias > Engenharia dos materiais

Outras Informações

ID Authenticus: P-007-T6K

DOI: 10.4028/www.scientific.net/ddf.297-301.972

Abstract (EN): The aim of this work is to join ¿-TiAl intermetallics to Ni based superalloys by solid state diffusion bonding. The surface of the ¿-TiAl alloys and Ni superalloys to be joined was prepared by magnetron sputtering with a few microns thick Ni/Al reactive multilayer thin films with nanometric modulation periods. Sound joining without cracks or pores is achieved along the central region of the bond, especially at 800°C and when a 14 nm period Ni/Al film is used as filler material. During the diffusion bonding experiments interdiffusion and reaction inside the Ni/Al multilayer thin film and between the interlayer film and the base materials is promoted with the formation of intermetallic phases. The final reaction product in the multilayer films is the B2-NiAl intermetallic phase. The interfacial diffusion layers between the base materials and the multilayer films should correspond to: ¿3- NiTiAl and ¿4-Ni2TiAl phases from the ¿-TiAl side; Ni-rich aluminide and ¿-phase from the Inconel side. These intermetallic phases are responsible for the hardness increase observed on the diffusion layers. © (2010) Trans Tech Publications.

Idioma: Inglês

Tipo (Avaliação Docente): Científica