Characterisation of thermal diode panels for use in the cooling season in buildings

• Tipo: Artigo em Revista Científica Internacional
• Data: 2002

Autores

Szabolcs Varga (Autor) FEUP; Armando C. Oliveira (Autor) FEUP; Clito F. Afonso (Autor) FEUP

Revista

Título: Energy and Buildings

Vol. 34 Nº 3

Páginas: 227-235

ISSN: 0378-7788

Editora: Elsevier

Indexação

ISI Web of Knowledge - 33 Citações

ISI Web of Science

Scopus - 44 Citações

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ID Authenticus: P-000-Q3K

DOI: 10.1016/S0378-7788(01)00090-1

Abstract (EN): Thermal diode panels, incorporating heat pipes, were tested under cooling season conditions. Their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. The method allowed the quantification of thermal characteristics for both operating modes: forward and backward heat transfer. Forward heat transfer led to an apparent thermal conductivity up to five times, the one for backward mode. (C) 2002 Elsevier Science B.V. All rights reserved.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 9