PRETREATMENTS TO IMPROVE THE ADHESION OF ELECTRODEPOSITS ON ALUMINUM

• Tipo: Artigo em Revista Científica Internacional
• Data: 1991

Autores

Fernando Mendes Monteiro (Autor) FEUP; Mário Adolfo Barbosa (Autor) FEUP; ROSS, DH (Autor) Outra; GABE, DR (Autor) Outra

Revista

Título: Surface and Interface Analysis

Vol. 17

Páginas: 519-528

ISSN: 0142-2421

Editora: Wiley-Blackwell

Indexação

ISI Web of Knowledge - 25 Citações

Scopus - 29 Citações

Outras Informações

ID Authenticus: P-001-QQJ

DOI: 10.1002/sia.740170720

Abstract (EN): Aluminium is generally regarded as a metal that is difficult to plate. By using a pretreatment sequence, which includes immersion in a zincate solution, it is possible to electroplate aluminium successfully, although adhesion levels are not always very high. Zincate solutions modified by the addition of various ions have been shown to promote adhesion. Using one such solution, an investigation has been carried out as to how, by modifying the pretreatment sequence, the adhesion on electrodeposits on aluminium can be improved. Such modifications included varying the etch procedures and using the so-called double dip technique. Some of the factors giving rise to the improved adhesion of electrodeposits have been investigated by SEM, AES, SIMS, ESCA, EPMA and AAS.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 10