Characterisation of thermal diode panels for use in the cooling season in buildings

• Type: Article in International Scientific Journal
• Date: 2002

Authors

Szabolcs Varga (Author) FEUP; Armando C. Oliveira (Author) FEUP; Clito F. Afonso (Author) FEUP

Journal

Title: Energy and Buildings

Vol. 34 No. 3

Pages: 227-235

ISSN: 0378-7788

Publisher: Elsevier

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ISI Web of Knowledge - 33 Citations

ISI Web of Science

Scopus - 44 Citations

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Other information

Authenticus ID: P-000-Q3K

DOI: 10.1016/S0378-7788(01)00090-1

Abstract (EN): Thermal diode panels, incorporating heat pipes, were tested under cooling season conditions. Their thermophysical properties were evaluated by measuring temperature distributions in an experimental test facility and by using numerical simulation together with an optimisation procedure. The method allowed the quantification of thermal characteristics for both operating modes: forward and backward heat transfer. Forward heat transfer led to an apparent thermal conductivity up to five times, the one for backward mode. (C) 2002 Elsevier Science B.V. All rights reserved.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 9