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New Soldering Join Performed Using the Cu-Sn-Cu System

Title
New Soldering Join Performed Using the Cu-Sn-Cu System
Type
Article in International Conference Proceedings Book
Year
1998
Authors
C. Gonçalves
(Author)
Other
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J. Ferreira
(Author)
Other
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I. Ferreira
(Author)
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E. Fortunato
(Author)
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A. P. Marvão
(Author)
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José Inácio Martins
(Author)
FEUP
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R. P. Martins
(Author)
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Conference proceedings International
Third Conference on Electronic Packing Technology
Nuremberg
Other information
Language: Portuguese
Type (Professor's evaluation): Scientific
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Related Publications

Of the same authors

Nova Tecnologia de Soldadura em Dispositivos Electrónicos (1998)
Article in International Conference Proceedings Book
C. Gonçalves; J. Ferreira; I. Ferreira; E. Fortunato; A. P. Marvão; José Inácio Martins; R. P. Martins
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