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Third Conference on Electronic Packing Technology

Title
Third Conference on Electronic Packing Technology
Type
International Conference Proceedings Book
Year
1998
Conference International
Third Conference on Electronic Packing Technology
Nuremberg
Other information
Language: Portuguese
Type (Professor's evaluation): Scientific
Documents
We could not find any documents associated to the publication.
Publications included
New Soldering Join Performed Using the Cu-Sn-Cu System
Article in International Conference Proceedings Book
C. Gonçalves (Author) (Other); J. Ferreira (Author) (Other); I. Ferreira (Author) (Other); E. Fortunato (Author) (Other); A. P. Marvão (Author) (Other); José Inácio Martins (Author) (FEUP); R. P. Martins (Author) (Other)
1998
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