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Investigação Experimental do Warpage e Rigidez em Wafers WLP de 300 mm
Title
Investigação Experimental do Warpage e Rigidez em Wafers WLP de 300 mm
Type
Thesis
Year
2021-12-16
Authors
João Pedro dos Santos Cardoso
(Author)
FCUP
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Master's Degree
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Scientific classification
FOS:
Natural sciences
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Language:
Portuguese
Documents
| File name | Description | Size |
|---|---|---|
| Tese final_João Cardoso | Investigação Experimental do Warpage e Rigidez em Wafers WLP de 300 mm | 7548.33 KB |
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