PRETREATMENTS TO IMPROVE THE ADHESION OF ELECTRODEPOSITS ON ALUMINUM

• Type: Article in International Scientific Journal
• Date: 1991

Authors

Fernando Mendes Monteiro (Author) FEUP; Mário Adolfo Barbosa (Author) FEUP; ROSS, DH (Author) Other; GABE, DR (Author) Other

Journal

Title: Surface and Interface Analysis

Vol. 17

Pages: 519-528

ISSN: 0142-2421

Publisher: Wiley-Blackwell

Indexing

ISI Web of Knowledge - 25 Citations

Scopus - 29 Citations

Other information

Authenticus ID: P-001-QQJ

DOI: 10.1002/sia.740170720

Abstract (EN): Aluminium is generally regarded as a metal that is difficult to plate. By using a pretreatment sequence, which includes immersion in a zincate solution, it is possible to electroplate aluminium successfully, although adhesion levels are not always very high. Zincate solutions modified by the addition of various ions have been shown to promote adhesion. Using one such solution, an investigation has been carried out as to how, by modifying the pretreatment sequence, the adhesion on electrodeposits on aluminium can be improved. Such modifications included varying the etch procedures and using the so-called double dip technique. Some of the factors giving rise to the improved adhesion of electrodeposits have been investigated by SEM, AES, SIMS, ESCA, EPMA and AAS.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 10