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Micro metal powder hot embossing: A new route to produce micro metallic parts

Title
Micro metal powder hot embossing: A new route to produce micro metallic parts
Type
Article in International Conference Proceedings Book
Year
2014
Authors
Ferreira, TJ
(Author)
Other
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Neto, VC
(Author)
Other
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Vieira, MT
(Author)
Other
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Conference proceedings International
Euro PM 2014 International Conference and Exhibition
21 September 2014 through 24 September 2014
Indexing
Other information
Authenticus ID: P-00K-7K2
Abstract (EN): Due to society requirements, development of replicative processes in micro-manufacturing became a main strategy to maintain high levels of competitiveness in several sectors of industry. Metal powder hot embossing is one of these replicative processes. It is an emerging and challenging process to produce micro-detailed metallic parts or devices. Metal powder hot embossing requires four distinctive steps: (1) preparation of feedstocks (implying the selection and characterization of powder and binder); (2) shape-forming of piece by hot-embossing (green part); (3) debinding (brown part); and (4) sintering (final part). The challenge of this study was to produce micro-metallic parts of complex geometry for the Portuguese industry of Engineering & Tooling, using metal-powder hot embossing. New developments made, in order to obtain the required micro-detailed part: employing a powder with d50 of 3.6 ¿m and making design modifications. Different parameters of shape forming (temperature and time) were tested, in order to optimize the process. After sintering the best green parts, other tests were performed: microstructure characterization, SEM/EDS analysis, micro-indentation tests, porosity quantification and 3D measurements. The best final parts have been obtained by processing at 180°C, with a cycle of (10/30/10) min at a pressure of 11 MPa.
Language: English
Type (Professor's evaluation): Scientific
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Microstructural Characterization of Metallic Parts Produced by Hot Embossing (2015)
Another Publication in an International Scientific Journal
E. W. Sequeiros; Ferreira, TJ; Neto, VC; Vieira, MT; Vieira, MF
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