Characterizing the intermetallic formed during ball attach process

• Tipo: Outra Publicação em Revista Científica Internacional
• Data: 2008

Autores

Paulo Pereira (Autor) FEUP; Santos, R (Autor) Outra; Maria M Barbosa (Autor) Outra; Catia Almeida (Autor) Outra

Revista

Título: Microscopy and Microanalysis

Vol. 14 Nº S3

Páginas: 17-18

ISSN: 1431-9276

Editora: Cambridge University Press

Indexação

ISI Web of Knowledge - 0 Citações

Scopus - 0 Citações

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia dos materiais

Outras Informações

ID Authenticus: P-003-WPC

DOI: 10.1017/s1431927608089253

Abstract (EN): Continuously miniaturization of electronic components using PCB's technology for the manufacturing of SDRAM's uses a solder ball attach process, producing a joint which robustness and electrical response are crucial factors to success. At present, near-eutectic Sn-Ag-Cu alloys are the leading candidates for Pb-free solders. According to Chun et al., the rapid formation of Cu-Sn intermetallic compounds at the interface affects the reliability of this solder joint and represents a major concern. In this study we characterize the interface of an attachment between the copper layer conductors of a memory and a solder ball which allows further bonding to printed circuit modules, see figure 1.a. © 2008 Microscopy Society of America.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 2