Stress-free temperature in a mixed-adhesive joint

• Type: Article in International Scientific Journal
• Date: 2006

Authors

Lucas F M Da Silva (Author) FEUP; Adams, RD (Author) Other

Journal

Title: Journal of Adhesion Science and Technology

Vol. 20

Pages: 1705-1726

ISSN: 0169-4243

Publisher: Taylor & Francis

Indexing

ISI Web of Knowledge - 45 Citations

Scopus - 57 Citations

Scientific classification

FOS: Engineering and technology > Chemical engineering

Other information

Authenticus ID: P-004-Q20

DOI: 10.1163/156856106779024436

Abstract (EN): Adhesive joints used in supersonic aircraft fuselage need to withstand low (-55 degrees C), as well as high (200 degrees C) temperatures. However, there are no adhesives suitable for the whole temperature range. A solution would be a joint with a combination of a low-temperature adhesive and a high-temperature adhesive, called a mixed-adhesive joint. In a bonded joint, the thermal stresses are generated essentially by the different thermal expansion properties of the adhesive and the adherends and, to a lesser extent, by the shrinkage of the adhesive produced by curing. The case of a mixed-adhesive joint is more complicated because there are two adhesives with different glass transition temperatures (T-g). To determine the stress-free temperature in a mixed adhesive joint, sandwich specimens of aluminium-adhesive-CFRP (carbon-fibre-reinforced plastic) were fabricated and the thermal strains were measured with strain gauges. In a mixed adhesive joint, two stress-free temperatures were found: the stress-free temperature of the high temperature adhesive, which is its cure temperature, and the stress-free temperature of the low temperature adhesive, which is its T-g..

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 22