Effect of mechanical properties and geometric dimensions on electromechanical impedance signatures for adhesive joint integrity monitoring

• Type: Article in International Scientific Journal
• Date: 2022

Authors

Tenreiro, AFG (Author) Other; António Mendes Lopes (Author) FEUP; da Silva, LFM (Author) FEUP; Amorim, JDP (Author) Other

Journal

Title: Mechanics of Advanced Materials and Structures

Pages: 1-16

ISSN: 1537-6494

Publisher: Taylor & Francis

Indexing

ISI Web of Knowledge - 0 Citations

Scopus - 1 Citation

Other information

Authenticus ID: P-00W-5J3

DOI: 10.1080/15376494.2022.2033891

Abstract (EN): Adhesive joints are prone to damage, which may be difficult to detect using Nondestructive Test. Structural Health Monitoring techniques, such as the Electromechanical Impedance Spectroscopy (EMIS), allow for continuous monitoring and early detection of structural defects. Developing efficient damage detection algorithms requires simulations of adhesive structures, which require elastic and damping properties under high frequency range. Tests were performed for crash-resistant and silicone adhesives. Numerical simulations with said properties were compared with experimental impedance measurements from Single Lap Joints (SLJ). This allowed for the estimation of adhesive properties, but numerical results for SLJs with silicone adhesive diverged from experimental results.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 16