THE RESIDUAL STRESSES ON MECHANICAL PROPERTIES OF COPPER THIN FILMS

• Tipo: Artigo em Livro de Atas de Conferência Internacional
• Data: 2012

Autores

Fernandes, CM (Autor) Outra; Vieira, MF (Autor) FEUP; Vieira, MT (Autor) Outra

Ata de Conferência Internacional

Título: Proceedings ICEM15 - 15th International Conference on Experimental Mechanics

ICEM15 - 15th International Conference on Experimental Mechanics

Porto, 22-27 July 2012

Indexação

ISI Web of Knowledge - 0 Citações

Outras Informações

ID Authenticus: P-005-K3Y

Abstract (EN): The present work investigates the impact of copper thin films residual stresses on mechanical properties values, namely hardness and tensile strength. Stress state from -1.4 to 0 GPa were discernible in copper thin films sputter-deposited on polyester (PET-Mylar) substrates. Whatever the stress state just a slight variation on mechanical properties has been noticed in the different thin films.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 4