Role of Soldering Parameters on the Electrical Perforances Presented by Cu-Sn-Cu Joins Used in Power Diodes

• Tipo: Artigo em Revista Científica Internacional
• Data: 2000

Autores

R. Martins (Autor) Outra; J. Ferreira (Autor) Outra; C. Gonçalves (Autor) Outra; P. Nunes (Autor) Outra; E. Fortunato (Autor) Outra; A. P. Marvão (Autor) Outra; José Inácio Martins (Autor) FEUP

Revista

Título: Materials Science and Engineering A

Vol. 288

Páginas: 275-279

ISSN: 0921-5093

Editora: Elsevier Science

Indexação

ISI Web of Science

Scopus

COMPENDEX

Outras Informações

Abstract (EN): Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on Cu–Sn–Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive conditions. © 2000 Elsevier Science S.A. All rights reserved.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 5