TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

• Tipo: Artigo em Revista Científica Internacional
• Data: 2010

Autores

Simoes, S (Autor) FEUP; Viana, F (Autor) FEUP; Ramos, AS (Autor) Outra; Vieira, MT (Autor) Outra; Vieira, MF (Autor) FEUP

Revista

Título: Microscopy and Microanalysis

Vol. 16 Nº 6

Páginas: 662-669

ISSN: 1431-9276

Editora: Cambridge University Press

Indexação

ISI Web of Knowledge - 10 Citações

ISI Web of Science

Scopus - 9 Citações

INSPEC

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia dos materiais

Outras Informações

ID Authenticus: P-003-0QQ

DOI: 10.1017/s143192761009392x

Abstract (EN): Reactive multilayer thin films that undergo highly exothermic reactions are attractive choices for applications in ignition, propulsion, and joining systems. Ni/Al reactive multilayer thin films were deposited by dc magnetron sputtering with a period of 14 nm. The microstructure of the as-deposited and heat-treated Ni/Al multilayers was studied by transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) in plan view and in cross section. The cross-section samples for TEM and STEM were prepared by focused ion beam lift-out technique. TEM analysis indicates that the as-deposited samples were composed of Ni and Al. High-resolution TEM images reveal the presence of NiAl in small localized regions. Microstructural characterization shows that heat treating at 450 and 700 degrees C transforms the Ni/Al multilayered structure into equiaxed NiAl fine grains.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 8