Joining of TiAl using a thin multilayer

• Tipo: Artigo em Revista Científica Internacional
• Data: 2006

Autores

Duarte, LI (Autor) Outra; Ramos, AS (Autor) Outra; Vieira, MF (Autor) FEUP; Viana, F (Autor) FEUP; Vieira, MT (Autor) Outra

Revista

A Revista está pendente de validação pelos Serviços Administrativos.

Título: ADVANCED MATERIALS FORUM III, PTS 1 AND 2

Vol. 15

Páginas: 1323-1327

Indexação

ISI Web of Knowledge - 5 Citações

Scopus - 6 Citações

Classificação Científica

FOS: Ciências da engenharia e tecnologias > Engenharia dos materiais

CORDIS: Ciências Tecnológicas > Engenharia > Engenharia de materiais

Outras Informações

ID Authenticus: P-004-P03

DOI: 10.4028/www.scientific.net/msf.514-516.1323

Abstract (EN): As TiAl based alloys begin to approach maturity, the development of successful and cost effective joining methods will be required. The growing industrial interest in these materials, particularly in aerospace and automotive industry, led to an interesting challenge - how to joint parts and components in order to produce integrated and resistant structures. Diffusion bonding of materials produces components with thinner interfaces than other joining techniques do. The absence of abrupt microstructure discontinuity and the small deformation induced maximize joint strength. This work focuses on the joining of TiAl using a thin multilayer obtained by alternating nanometric layers of titanium and aluminium. The Ti/Al layers were deposited onto the gamma-TiAl samples by DC magnetron sputtering. The inter-faces of these diffusion bonded joints depend on processing and deposition conditions. In this work we describe the influence of bilayer thickness (period) and on microstructure and chemical composition of the joining interfaces.

Idioma: Inglês

Tipo (Avaliação Docente): Científica

Nº de páginas: 5