Diffusion bonding of gamma-TiAl using modified Ti/Al nanolayers

• Type: Article in International Scientific Journal
• Date: 2012

Authors

Duarte, LI (Author) Other; Viana, F (Author) FEUP; Ramos, AS (Author) Other; Vieira, MT (Author) Other; Leinenbach, C (Author) Other; Klotz, UE (Author) Other; Vieira, MF (Author) FEUP

Journal

Title: Journal of Alloys and Compounds

Vol. 536

Pages: S424-S427

ISSN: 0925-8388

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 30 Citations

ISI Web of Science

Scopus - 33 Citations

Scientific classification

FOS: Engineering and technology > Materials engineering

CORDIS: Technological sciences

Other information

Authenticus ID: P-002-5CM

DOI: 10.1016/j.jallcom.2011.12.037

Abstract (EN): Solid state diffusion bonding has been successfully employed to join gamma-TiAl alloys. Processed in vacuum, at high temperature and pressure, the thin interfaces and the lack of structural discontinuity across the interface are the main advantage of this joining technique. An interlayer made of alternated Ti and Al nanometric layers that increases the diffusivity at the joint interface, was used in order to assist the bonding process of gamma-TiAl alloys. The use of Ti/Al interlayer has efficiently reduced the joining temperature. Sound joints have been achieved at a temperature of 900 degrees C under a pressure of 50 MPa in vacuum. In the present work Cu was added as third element to the Ti/Al multilayers and its effect improved the bonding quality. The interface microstructure was studied by scanning and transmission electron microscopy.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 4