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Role of Soldering Parameters on the Electrical Perforances Presented by Cu-Sn-Cu Joins Used in Power Diodes
Title
Role of Soldering Parameters on the Electrical Perforances Presented by Cu-Sn-Cu Joins Used in Power Diodes
Type
Article in International Scientific Journal
Year
2000
Authors
R. Martins
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J. Ferreira
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C. Gonçalves
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P. Nunes
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E. Fortunato
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A. P. Marvão
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José Inácio Martins
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Resumo (PT):
Abstract (EN):
Results are presented on the electrical characteristics of power diodes soldered using new lead-free techniques based on
Cu–Sn–Cu joints. Special emphasis is put on the role of the thickness of the Cu films electrodeposited on the electrical
performances of the power diodes joined and to study the electrical stability of the joints formed, under extreme aggressive
conditions. © 2000 Elsevier Science S.A. All rights reserved.
Language:
English
Type (Professor's evaluation):
Scientific
No. of pages:
5
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