EFFECT OF CURE TEMPERATURE ON THE GLASS TRANSITION TEMPERATURE OF AN EPOXY ADHESIVE

• Type: Article in International Conference Proceedings Book
• Date: 2012

Authors

Carbas, RJC (Author) Other; Marques, EAS (Author) FEUP; António Mendes Lopes (Author) FEUP; da Silva, LFM (Author) FEUP

Conference proceedings International

Title: Proceedings ICEM15 - 15th International Conference on Experimental Mechanics

ICEM15 - 15th International Conference on Experimental Mechanics

Porto, 22-27 July 2012

Indexing

ISI Web of Knowledge - 1 Citation

Scientific classification

FOS: Engineering and technology > Mechanical engineering

Other information

Authenticus ID: P-005-K2T

Abstract (EN): This work was undertaken to improve the understanding of the effect of curing temperature in the glass transition temperature, Tg, of an epoxy adhesive. The curing process was the same for all tests, consisting of a curing stage followed by a post cure stage. The initial stage was performed at different temperatures while the post curing stage was always performed at room temperature until the adhesive was completely cured. T-g was found to vary as a function of the cure temperature of the adhesive. When cured below the glass transition temperature of the fully cured network, T-g infinity, the T-g is lower than the cure temperature. When cured above T-g infinity, the T-g is higher than the cure temperature.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 2