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New Adhesion Process based in Lead Free Solder Applied in Electronic Power Devices
Title
New Adhesion Process based in Lead Free Solder Applied in Electronic Power Devices
Type
Article in International Conference Proceedings Book
Year
2001
Authors
H. Seiroco
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J. Ferreira
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M. Vicente
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Francisco M. Braz Fernandes
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R. Martins
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E. Fortunato
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A. P. Marvão
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José Inácio Martins
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Conference proceedings International
Title:
International Symposium And exhibition on Advanced Packaging Materials
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International Symposium And exhibition on Advanced Packaging Materials
Georgia, USA, 11 a 14 Março de 2001
Other information
Language:
Portuguese
Type (Professor's evaluation):
Scientific
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