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A comprehensive analysis of a pseudo-brittle fracture at the interface of intermetallic of eta and steel in aluminum/steel joints made by FSW: Microstructure and fracture behavior

Title
A comprehensive analysis of a pseudo-brittle fracture at the interface of intermetallic of eta and steel in aluminum/steel joints made by FSW: Microstructure and fracture behavior
Type
Article in International Scientific Journal
Year
2021
Authors
Beygi, R
(Author)
Other
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Ricardo Carbas
(Author)
FEUP
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Barbosa, AQ
(Author)
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Marques, EAS
(Author)
FEUP
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da Silva, LFM
(Author)
FEUP
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Vol. 824
ISSN: 0921-5093
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Authenticus ID: P-00V-A72
Abstract (EN): Intermetallic compounds (IMCs) formation during friction stir welding (FSW) of dissimilar metals such as aluminum (Al) and steel (St) is known to cause a reduction in the joint strength. IMCs are brittle and act as the preferential sites for fracture propagation. In the present study, a modified FSW was used to join a commercially pure Al to a mild carbon St. Several characterization techniques were performed to analyze the joint interface and the results revealed that a nanostructured IMC layer made of Fe4Al13 (theta) and a micrometer IMC layer made of Fe2Al5 (eta) were formed adjacent to the Al side and St side, respectively. During the tensile test, the crack propagated through the interface of q-St and not through the IMCs layer. It was shown that the interface of q-St was prone to brittle debonding under normal load, but it showed a slight plastic deformation at the triple junctions with the eta grain boundaries. At the triple junctions of boundaries, the loading state was shear and no debonding occurred during the tensile test. This promoted a pseudo-brittle fracture surface. The results of the present study showed that the grain refinement of the IMCs can improve the joint strength of the dissimilar materials through increasing the fracture toughness of the IMC and increasing the number of triple junctions at the interface of metal-IMC.
Language: English
Type (Professor's evaluation): Scientific
No. of pages: 12
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