TEM Characterization of As-Deposited and Annealed Ni/Al Multilayer Thin Film

• Type: Article in International Scientific Journal
• Date: 2010

Authors

Simoes, S (Author) FEUP; Viana, F (Author) FEUP; Ramos, AS (Author) Other; Vieira, MT (Author) Other; Vieira, MF (Author) FEUP

Journal

Title: Microscopy and Microanalysis

Vol. 16 No. 6

Pages: 662-669

ISSN: 1431-9276

Publisher: Cambridge University Press

Indexing

ISI Web of Knowledge - 10 Citations

ISI Web of Science

Scopus - 9 Citations

INSPEC

Scientific classification

FOS: Engineering and technology > Materials engineering

Other information

Authenticus ID: P-003-0QQ

DOI: 10.1017/s143192761009392x

Abstract (EN): Reactive multilayer thin films that undergo highly exothermic reactions are attractive choices for applications in ignition, propulsion, and joining systems. Ni/Al reactive multilayer thin films were deposited by dc magnetron sputtering with a period of 14 nm. The microstructure of the as-deposited and heat-treated Ni/Al multilayers was studied by transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) in plan view and in cross section. The cross-section samples for TEM and STEM were prepared by focused ion beam lift-out technique. TEM analysis indicates that the as-deposited samples were composed of Ni and Al. High-resolution TEM images reveal the presence of NiAl in small localized regions. Microstructural characterization shows that heat treating at 450 and 700 degrees C transforms the Ni/Al multilayered structure into equiaxed NiAl fine grains.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 8