Production of low cost contacts and joins for large area devices by electrodeposition of Cu and Sn

• Type: Article in International Scientific Journal
• Date: 2000

Authors

J. Ferreira (Author) Other; E. Fortunato (Author) Other; A. P. Marvão (Author) Other; José Inácio Martins (Author) FEUP

Journal

Title: Applied Surface Science

Vol. 168 No. 1-4

Pages: 292-295

ISSN: 0169-4332

Publisher: Elsevier

Indexing

ISI Web of Knowledge - 4 Citations

ISI Web of Science

Scopus - 4 Citations

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Other information

Authenticus ID: P-000-Y66

DOI: 10.1016/S0169-4332(00)00627-9

Abstract (EN): The aim of this paper is to present results concerning the morphology, structure, mechanical and electrical characteristics of the new proposed Cu-Sn metallurgical alloy, which may be used in electronic joins. By proper choice of process temperature and pressure, Cu coated surfaces are soldered using Sn as pre-form. The main results achieved indicate that the formation of Cu3Sn phase begins at a temperature of about 473 K and that the Sn thickness (dSn) needed is slightly above 7 μm. Due to join wettability, higher temperatures (between 523 and 573 K) and dSn above 35 μm are required to form joins within the specifications of the electronic industry.

Language: English

Type (Professor's evaluation): Scientific

No. of pages: 4